3808-2 UV Tack-Reducing Adhesive for Wafer Temporary Bonding
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3808-2 UV Tack-Reducing Adhesive for Wafer Temporary Bonding

China GuangdongShenzhen Taile Glue Co., Ltd.

US$7.20 - 11.00

MOQ10 Pieces

Product profile

Form
Transparent Liquid
Viscosity(25℃)
800~1500 MPa·S
Initial Cure Time
15 S (UV 365nm, 100 Mj/Cm²)
Curing Wavelength
365 Nm UV Light
Standard UV Energy
100 Mj/Cm²
Controllable Dry Film Thickness
10~30 μm
Operating Temperature
-20℃ ~ 60℃
Compliance
RoHS, Reach Compliant
Shelf Life
12 Months
Peel Strength Before UV
~10 N/in
Peel Strength After UV
~0.2 N/in
Storage
5-25℃, Sealed & Dark
Characteristic
Temporary Bonding, Peelable, No Residue, Ultra-Cle
Features
Precision Processing, Semiconductor, Electronics

Company profile

Shenzhen Taile Glue Co., Ltd.

深圳市泰乐新材料有限公司
China GuangdongRoom 615, Building A1, Fuhai Industrial Zone, Fuyong Community, Fuyong Subdistrict, Bao'an District, Shenzhen
  • CertifiedVerified Supplier
  • CertifiedTrade Assurance
  • Business Type: Trading Company
  • Established: 2024
  • Employees: 5
  • Plant Area: 108.0m²
  • Avg. Response Time: ≤ 2.76h
  • Certification: -
  • System Certification: NIL

Main Products

  • Cyanoacrylate Adhesive
  • Ab Glue
  • UV Glue
  • Electronic Adhesive
  • High Temperature Adhesive
  • Structural Adhesive
  • Industrial Adhesive
  • Conformal Coating
  • Sealant
  • All Purpose Glue

Main Markets

Domestic