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Ad832I Automatic Die Bonding System, High Accuracy Semiconductor Assembly Equipment
China GuangdongShenzhen Tengxiangjia Technology Co., Ltd.
US$100000.00 - 120000.00
MOQ1 Pieces
Product profile
- Equipment Type
- Fully Automatic Die Bonding Machine
- Bonding Accuracy
- ±15μm
- Max Processing Speed
- 12000 Dies Per Hour
- Applicable Die Size
- 0.3mm-12mm
- Working Voltage
- 220V 50/60Hz
Company profile
Shenzhen Tengxiangjia Technology Co., Ltd.
深圳市腾翔佳科技有限公司China GuangdongShenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Trading Company
- Established: 2016
- Employees: 15
- Plant Area: 600.0m²
- Avg. Response Time: ≤ 3.59h
- Certification: -
- System Certification: NIL
Main Products
- SMT Machine
- Pick and Place Machine
- Feeder
Main Markets
Domestic
