Click to enlarge
Advanced High-Precision Automated Die Bonder for Multi-Chip Solutions
China JiangsuJiangsu Himalaya Semiconductor Co., Ltd.
US$28000.00 - 200000.00
MOQ1 Pieces
Product profile
- Xy Placement Accuracy
- ±5um @ 3 Sigma ±3um
- Die Rotation Accuracy
- ±0.3° @ 3 Sigma
- Bonding Force
- 10GF-200GF (Programmable)
- Cycle Time
- ≤ 6 S
- Epoxy System
- Stamping or Dispensing
- Wafer Ring
- 4*6 Inch
- Optics System
- 3 Set Aligning Cameras + 1 Set Uplook Camera
- Substrate Size
- Width: 50-100 mm / Length: 50-200 mm
Company profile
Jiangsu Himalaya Semiconductor Co., Ltd.
江苏喜马拉雅半导体有限公司China JiangsuRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China- CertifiedVerified Supplier
- Business Type: Trading Company
- Established: 2019
- Employees: 11
- Plant Area: 83.0m²
- Avg. Response Time: ≤ 3.76h
- Certification: -
Main Products
- Die Bonder
- Wire Bonding
- Laser Marking(ID IC Wafer)
- Laser Grooving
- Laser Cutting(Glass Ceramics Wafers Packaging
- Laser Internal Modification Machine Si /Sic Wafe
- Laser Internal Modification Machine Lt/Ln Wafer
- Laser Annealing Machine for Si/Sic
- Automatic Dicing Saw Machine(Wafer Packaging))
- Automatic Silicone Dispensing Equipment
Main Markets
Europe
