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AM3354 Development Board with Dual Gigabit Ethernet Ports
Hebei, ChinaBaoding Forlinx Embedded Technology Co., Ltd.
US$112.72 - 128.09
MOQ1 Minimum
Product profile
- Architecture
- Cortex-A8
- carrier board size
- 190 x 130mm
- Place of Origin
- Hebei, China
- Flash
- 256M NandFlash
- Model Number
- OK335xS
- Brand Name
- Forlinx
- Connection Method
- CPU module soldered on carrier board
- Model
- OK335XS
- LCD
- RGB888
- RAM
- 512M DDR3
- Supply Ability
- 100000 pieces per Month
- Main Frequency
- 800MHZ
- Packaging Details
- 1 piece /box, size of the box: 240*190*100mm
- CPU
- TI AM3354
- OS
- Linux,Win CE,Android,Starter hole
- Port of dispatch
- Beijing/Shenzhen/HongKong
- Selling Units
- Single item
Company profile
Baoding Forlinx Embedded Technology Co., Ltd.
保定飞凌嵌入式技术有限公司Hebei, ChinaNo. 2699 Xiangyang North Street Baoding Hebei China- CertifiedTrade Assurance
- Business Type: Manufacturer, Trading Company
- Established: 2007
- Employees: 301 - 500 People
- Plant Area: 3,000-5,000 square meters
- Annual Export Value: US$5 Million - US$10 Million
- Avg. Response Time: ≤ 4h
Main Products
- embedded ARM single board computer
- development board
- CPU module
- expand modules
- LCD module
Main Markets
Domestic Market(80.0%), Western Europe(5.0%), North America(3.0%), Southern Europe(3.0%), Eastern Asia(3.0%), Northern Europe(1.5%), South Asia(1.0%), Southeast Asia(1.0%), Eastern Europe(1.0%), South America(1.0%), Oceania(0.5%)
