Anti-Static Anti-High Temperature Shielding Aluminum Foil Bag for Electronic Components
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Anti-Static Anti-High Temperature Shielding Aluminum Foil Bag for Electronic Components

China GuangdongShenzhen Xunlan Technology Co., Ltd.

$0.09 - $0.99

MOQ5000 Pieces

Product profile

Bag Sealing Methods
Flat Bag Packaging
Function
Barrier O2 and Moisture
Color
Silver, White or Customized
Conventional Thickness
0.075~0.2 mm
Accessories
Zipper, Tear Notch, Lip, Hang Hole, etc
Hardness
Soft
Quotation
Based on Material, Size, Color, Thickness, Qt
Sample
in Stock Blank Sample for Free
Customized Sample
Be Charged Printed Version Fee and Taking 7 Days
Sealing
Flat Open, Ziplock
Printing Way
Copperplate Printing or Offset Printing

Company profile

Shenzhen Xunlan Technology Co., Ltd.

深圳市迅蓝科技有限公司
China Guangdong2nd Floor, Building 1, Fuzhen Industrial Park, Yutang Street, Guangming District, Shenzhenguangdong P. R. China 518105, Shenzhen, Guangdong, China
  • CertifiedTrade Assurance
  • Business Type: Manufacturer/Factory
  • Avg. Response Time: ≤ 2.38h
  • System Certification: ISO 9001,ISO 14001

Main Products

  • Bubble Malier
  • Corrugated Padded Envelope
  • Padded Shipping Envelope
  • Honeycomb Paper Envelope
  • ESD Bag
  • Aluminum Foil Bags
  • Thermal & Insulation
  • Carton Box
  • Vacuum Pouch Bag
  • Conductive Bag

Main Markets

South America,North America,Southeast Asia,Eastern Asia