Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
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Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI

China GuangdongGuangzhou Minder-Hightech co.,Ltd

US$140000.00 - 220000.00

MOQ1 Pieces

Product profile

Weight
1100kg
Dimensions(W X D X H)
1240 X 1160 X 1830mm
Magazines
2 PCS
Wafer Ring Size
6 Inch*2 & 8 Inch

Company profile

Guangzhou Minder-Hightech co.,Ltd

广州铭钿高精焊接设备有限公司
China GuangdongRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
  • CertifiedTrade Assurance
  • Business Type: Trading Company
  • Established: 2014
  • Employees: 10
  • Plant Area: 260.0m²
  • Avg. Response Time: ≤ 6.92h
  • System Certification: NIL

Main Products

  • Wire Bonder
  • Soldering Machine
  • Bond Tester
  • Grinder and Polisher
  • Dicing Saw
  • Die Bonder
  • Plasma Surface Treatment Machine
  • Ultrasonic Metal Welder
  • Glue Dispenser
  • Parallel Sealing Welder

Main Markets

Europe,North America