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Automatic IC Wafer Edge Processing Machine for Ultra Precision Wafer
Nanjing Bang Win Imp & Exp Co., Ltd.
US$7000.00
Lead Time
| Quantity | 旺季 | 淡季 |
|---|---|---|
| 1 - 1 | 30 days | 30 days |
| > 1 | To be negotiated | To be negotiated |
Product profile
- application
- silicon wafers
- brand name
- BW
- Voltage
- 380 V
- Grinding Speed
- 1mm/s-50mm/s
- core components
- PLC
- machinery test report
- Provided
- Wafer Center Positioning Accuracy
- ≤±0.1mm
- warranty
- 1 Year
- place of origin
- Jiangsu, China
- Minimum Vacuum Disc Movement Step
- <±0.01mm
- Single volume
- 0 cm³
- External Dimensions
- 1560x700x940mm
- Main Motor Speed
- 0-90rpm
- weight (kg)
- 350
- power (kw)
- 2
- Vacuum Chuck Repeatability
- ≤±0.01mm
- Grinding Wheel Speed
- 0-4500rpm Adjustable
- key selling points
- Automatic
- Adhesion Force
- Better than -80Kpa
- Single gross weight
- 0.0 kg
- video outgoing-inspection
- Provided
- Workpiece Size
- 3-6 inches
- Grinding Disc Size
- 4 inches
- Selling Units
- Single item
Company profile
Nanjing Bang Win Imp & Exp Co., Ltd.
南京邦为进出口贸易有限公司L1-60, 61, 62, No. 1, Helu Road, Central North Road Nanjing Jiangsu China- CertifiedTrade Assurance
- Business Type: Trading Company
- Established: 2017
- Employees: 11 - 50 People
- Avg. Response Time: ≤ 6h
Main Products
- Pipe Punching Machine
- Pipe chamfering machine
- Tube end forming machine
- Wire Drawing Machine
- Motor Related Machines
