Bonding Machine for Multilayer Press Process
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Bonding Machine for Multilayer Press Process

China GuangdongDongguan Dinglu Electronic Technology Co., Ltd.

$67000.00

MOQ1 set

Product profile

Automatic Grade
Automatic
Application
Machinery & Hardware
Driven Type
Electric
Gluing Mode
Bonding
Packaging Material
Prepreg and Metal Core
Packaging
Wooden Case

Company profile

Dongguan Dinglu Electronic Technology Co., Ltd.

东莞市鼎麓电子科技有限公司
China Guangdong3f, No 19, Baida West Road, Humen Town, Dongguan, Guangdong, China
  • CertifiedVerified Supplier
  • CertifiedTrade Assurance
  • Business Type: Combined
  • Established: 2015
  • Employees: 29
  • Plant Area: 3000.0m²
  • Avg. Response Time: ≤ 11.88h
  • Certification: ISO9001:2015 certificate
  • System Certification: ISO9001:2015 certificate

Main Products

  • PCB Metallographic Sample Cutting Machine
  • PCB Metallographic Grinding Machine
  • PCB Metallographic Microscope
  • PP Prepreg Cutting Machine
  • PCB Lind Width Testing Machine
  • PCB Panel Thickness Testing Machine
  • PCB Peel Strength Testing Machine
  • PCB Bonding Machine
  • Peel Strength Tester
  • Mutilayer Press Machine

Main Markets

Southeast Asia/ Mideast,East Asia(Japan/ South Korea),Domestic,Europe,North America