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China Used Semiconductor Die Bonding Machine Besi Esec 2009 Ssie Die Bonder
China GuangdongGuangdong Xinling Industrial Co., Ltd
US$460000.00 - 690000.00
MOQ1 Pieces
Product profile
- Characteristics
- Used
- Product Number
- Datacon 2200 Evo G4
- Quality
- Tested
- Types
- Die Bonder
- Usage
- Besi Die Bonding Machine
- Industry
- Semiconductor
- Supply Ability
- 2000 PCS
- Price
- Good
Company profile
Guangdong Xinling Industrial Co., Ltd
广东芯灵实业有限公司China GuangdongChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2021
- Employees: 11
- Plant Area: 600.0m²
- Avg. Response Time: ≤ 5.43h
- Certification: -
Main Products
- One-Stop SMT Equipment and Parts
- SMT Screen Printer
- Chip Mounter
- One-Stop Semiconductor Equipment and Part
- Die Bonders
- Wire Bonders
- Test Handler
- Wafer Dicing Saw
- Fiber Optic Cable
- Optical Transceiver
Main Markets
Others(foreignTradeCapacity.exportBusinessCapacityMarketOther),Domestic,Europe
