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High-Precision CO2 Laser Cutter for Ceramic Engraving Projects
China JiangsuJiangsu Himalaya Semiconductor Co., Ltd.
US$370000.00 - 400000.00
MOQ1 Pieces
Product profile
- Processing Area
- 200mm×200mm(Customizable)
- Positioning Accuracy
- ±3μm
- Repeat Accuracy
- ±2μm
- Scribing Speed
- 200mm/S
- Cutting Speed
- 20mm/S
Company profile
Jiangsu Himalaya Semiconductor Co., Ltd.
江苏喜马拉雅半导体有限公司China JiangsuRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China- CertifiedVerified Supplier
- Business Type: Trading Company
- Established: 2019
- Employees: 11
- Plant Area: 83.0m²
- Avg. Response Time: ≤ 3.76h
- Certification: -
Main Products
- Die Bonder
- Wire Bonding
- Laser Marking(ID IC Wafer)
- Laser Grooving
- Laser Cutting(Glass Ceramics Wafers Packaging
- Laser Internal Modification Machine Si /Sic Wafe
- Laser Internal Modification Machine Lt/Ln Wafer
- Laser Annealing Machine for Si/Sic
- Automatic Dicing Saw Machine(Wafer Packaging))
- Automatic Silicone Dispensing Equipment
Main Markets
Europe
