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High Precision Double-Sided Grinding Machine Surface Equipment
China GuangdongShenzhen Ponda Grinding Technology Co.,Ltd.
$30000.00 - $50000.00
MOQ1 Pieces
Product profile
- Power Source
- Electricity
- Disc(Wheel) Type
- Grinding Disc
- Material
- Metal
- Variable Speed
- with Variable Speed
- Object
- Quartz Crystal, Silicon Wafer, Gallium Arsenide Sh
- Application
- Grinding Industry
- Disc Diameter
- 640mm
- Service
- Oversea Setup & After-Sale Avalaible
- Class
- Double Plate
- Process Station
- 3-5
- Pressure Source
- Pneumatic
- Plate Material
- Metal and Non-Metal
- Abrasive
- Lapping Slurry
Company profile
Shenzhen Ponda Grinding Technology Co.,Ltd.
深圳市方达研磨技术有限公司China GuangdongFangda Industrial Park, Guangming, Shenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2007
- Employees: 60
- Plant Area: 11500.0m²
- Avg. Response Time: ≤ 4.37h
- Certification: -
Main Products
- Lapping Machine
- Polishing Machine
- Double-Disc Lapping Machine
- Double-Disc Polishing Machine
- Wafer Thinner
- Substrate Thinner
- Brush-Polishing Machine
- Lathe Machine
- Grinding Machine
- Thinning Machine
Main Markets
Southeast Asia/ Mideast,East Asia(Japan/ South Korea),Domestic,Europe,Australia,North America
