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High Precision Fully-Automatic Silicon Carbide Flat Honing and Lapping Machine Thinning Machine
China GuangdongShenzhen Ponda Grinding Technology Co.,Ltd.
US$155840.00 - 183774.00
MOQ1 Pieces
Product profile
- Power Source
- Electricity
- Working Style
- High-Speed Universal
- Variable Speed
- with Variable Speed
- Object
- Wafer
- Application
- Electronic Technique
- Disc(Wheel) Type
- Thinning Machine
Company profile
Shenzhen Ponda Grinding Technology Co.,Ltd.
深圳市方达研磨技术有限公司China GuangdongFangda Industrial Park, Guangming, Shenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2007
- Employees: 60
- Plant Area: 11500.0m²
- Avg. Response Time: ≤ 6.84h
- Certification: -
Main Products
- Lapping Machine
- Polishing Machine
- Double-Disc Lapping Machine
- Double-Disc Polishing Machine
- Wafer Thinner
- Substrate Thinner
- Brush-Polishing Machine
- Lathe Machine
- Grinding Machine
- Thinning Machine
Main Markets
Southeast Asia/ Mideast,East Asia(Japan/ South Korea),Domestic,Europe,Australia,North America
