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High Precision Grinding Machine
China GuangdongShenzhen Ponda Grinding Technology Co.,Ltd.
US$280000.00 - 320000.00
MOQ1 Pieces
Product profile
- Wheel Diameter
- Medium 209 mm
- Wheel R. Speed
- 500- 3000 Min-1
- G. Wheel R.Speed
- 0-4000min
- Vacuum Table R.Speed
- 0-300min
- in-Feed Resolution
- 0.1-80um/S
- Fast Traverse Speed
- 10mm/S
- Max.Vacuum Pressure
- -90 Kpa
- Ttv
- Less Than or Equal To3um
- Surface Roughness
- Ra0.015um
- Total Power
- 21kw
- External Dimension
- 1300X2770X1920mm
- Total Weight
- 5000kg
- No.of Vacuum Table
- 3
- Applicable Wafer Size
- 2 To12-Inch Standard Wafer
Company profile
Shenzhen Ponda Grinding Technology Co.,Ltd.
深圳市方达研磨技术有限公司China GuangdongFangda Industrial Park, Guangming, Shenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2007
- Employees: 60
- Plant Area: 11500.0m²
- Avg. Response Time: ≤ 6.84h
- Certification: -
Main Products
- Lapping Machine
- Polishing Machine
- Double-Disc Lapping Machine
- Double-Disc Polishing Machine
- Wafer Thinner
- Substrate Thinner
- Brush-Polishing Machine
- Lathe Machine
- Grinding Machine
- Thinning Machine
Main Markets
Southeast Asia/ Mideast,East Asia(Japan/ South Korea),Domestic,Europe,Australia,North America
