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K&S Maxum Plus Fully Automatic High-Speed Gold Ball Wire Bonder, Semiconductor Packaging Equipment for IC, LED & Microchip Production
China GuangdongShenzhen Tengxiangjia Technology Co., Ltd.
US$23000.00 - 40000.00
MOQ1 Pieces
Product profile
- Machine Type
- Automatic Wire Bonder (Ball Bonding)
- Bonding Force
- Closed-Loop Controlled
- Ultrasonic Frequency
- 58 kHz / 120 kHz (Selectable)
- Wire Diameter Range
- 18μm -50μm (0.7 Mil -2.0 Mil)
- Vision System
- High-Resolution Digital CCD
- Search Field (Fs)
- Standard and High-Resolution Modes
- Bonding Accuracy
- < ±25μm / ±10% of Wire Diameter
Company profile
Shenzhen Tengxiangjia Technology Co., Ltd.
深圳市腾翔佳科技有限公司China GuangdongShenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Trading Company
- Established: 2016
- Employees: 15
- Plant Area: 600.0m²
- Avg. Response Time: ≤ 3.59h
- Certification: -
- System Certification: NIL
Main Products
- SMT Machine
- Pick and Place Machine
- Feeder
Main Markets
Domestic
