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Manual DIP BGA Automatic Tin Lead Selective Wave Surface Mount BGA SMD Reflow SMT Soldering
China GuangdongFoshan Xi Feng Tin Products Co., Ltd.
US$25.00 - 65.00
MOQ50 kg
Product profile
- Composition
- Contain 99.3 of Tin and 0.7 of Copper
- Application
- LED, PCB, Precise Instruments and Electronic Comp
- Feature
- No Clean, Bright Spot, No Splash and Smokeless
- Alloy
- Sn99.3cu0.7 Sac07 Solder Wire
- Alloy 2
- Sn99AG0.3cu0.7 Sac0307 Solder Wire
- Alloy 3
- Sn96.5AG3cu0.5 Sac305 Solder Wire
- Core
- Resin Cored Solder Wire
- Core 2
- Flux Core Solder Wire
- Name
- Lead Free Solder Wire
- Diameter
- 1mm Solder Wire
- Weight
- 454G Per Spool Solder Wire
- Application 2
- for Electrical Soldering
- Application 3
- for Stained Glass Soldering
- Application 4
- for Radiator Soldering
- Application 5
- for Stainless Steel Sheet Soldering
Company profile
Foshan Xi Feng Tin Products Co., Ltd.
佛山市西锋锡制品有限公司China GuangdongShunde, Xingtan, Foshan, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2013
- Employees: 11
- Plant Area: 680.0m²
- Avg. Response Time: ≤ 3.19h
- Certification: -
- System Certification: NIL
Main Products
- Solder Wire
- Solder Bar
- Solder Paste
- Solder
- Lead Free Solder Wire
- Tin Lead Solder Paste
- Lead Free Solder Paste
- Tin Solder Wire
- Tin Lead Solder Wire
- Solder Ingot
Main Markets
South America,Africa,Others(foreignTradeCapacity.exportBusinessCapacityMarketOther),Domestic,Europe,Australia,North America
