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No4 Sac305 SMT Reflow Solder Paste Lead Free for Laptops and Computers
China GuangdongFoshan Xi Feng Tin Products Co., Ltd.
US$30.00 - 80.00
MOQ30 kg
Product profile
- Alloy
- Lead Free
- Powder Size
- Type 3: 25 to 45 Microns
- Powder Size 2
- Type 4: 20 to 38 Microns
- Flux
- No Clean Flux
- Alloy 2
- Sac305 Sn96.5AG3.0cu0.5
- Alloy 3
- Sac0307 Sn99AG0.3cu0.7
- Alloy 4
- Sn42bi58 Low Temperature
- Certificate
- RoHS
- Packing
- Jar
- Packing 2
- Syringe
- Shipping
- Courier / Air Freight
- Shelf Life
- 6months
- Storage
- 0 to 10 Degree Celsius
- Application 2
- for SMT Reflow Soldering
- Application 3
- for Laptops and Computers Manufacturing
Company profile
Foshan Xi Feng Tin Products Co., Ltd.
佛山市西锋锡制品有限公司China GuangdongShunde, Xingtan, Foshan, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2013
- Employees: 11
- Plant Area: 680.0m²
- Avg. Response Time: ≤ 3.50h
- Certification: -
- System Certification: NIL
Main Products
- Solder Wire
- Solder Bar
- Solder Paste
- Solder
- Lead Free Solder Wire
- Tin Lead Solder Paste
- Lead Free Solder Paste
- Tin Solder Wire
- Tin Lead Solder Wire
- Solder Ingot
Main Markets
South America,Africa,Others(foreignTradeCapacity.exportBusinessCapacityMarketOther),Domestic,Europe,Australia,North America
