Click to enlarge
Semi Automatic Flip Chip Die Bonder Semiautomatic with High Precision Termway
China BeijingTermway (Beijing) Precision Technology Co., Ltd.
US$90500.00 - 119000.00
MOQ1 Pieces
Product profile
- Max. Chip Size
- 20mm * 20mm (50*50mm Optional)
- Min. Chip Size
- 0.2mm * 0.2mm
- Mounting Precision
- ±3um 3δ
- Feeding Mode
- 2 Inch Waffle Box*2
- Substrate Size
- 150*150mm
- X Y Z Axis Motion System
- Roller Screw + Servo Motor
- X Y Axis Resolution
- 0.1um
- Power Supply
- 220V, 50Hz
- Net Weight
- 300kg
Company profile
Termway (Beijing) Precision Technology Co., Ltd.
泰姆瑞（北京）精密技术有限公司China Beijing12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2012
- Employees: 28
- Plant Area: 1100.0m²
- Avg. Response Time: ≤ 23.46h
Main Products
- PCB Assembly
- Pick&Place Machine
- Reflow Oven/Wave Machine
- Screen Printer
- Dispenser
- BGA Station
- Chip Checking Microscope
- PCB Plate Making Machine
- Exposure Machine
- Etching Machine
Main Markets
East Asia(Japan/ South Korea),Europe,North America
