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Semiconductor Equipment Besi Wire Bonding Machine Esec 2100 Besi Wire Bonding Machine
China GuangdongGuangdong Xinling Intelligent Equipment Co., Ltd
US$19999.00 - 23999.00
MOQ1 Pieces
Product profile
- Delivery
- 1-7 Days
- Quality
- 100% Tested
- Adaptation
- Die Bonder
- Inventory
- Availability
Company profile
Guangdong Xinling Intelligent Equipment Co., Ltd
广东芯灵智能装备有限公司China GuangdongShenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Trading Company
- Established: 2013
- Employees: 12
- Plant Area: 300.0m²
- Avg. Response Time: ≤ 6.20h
- Certification: -
Main Products
- Wafer Cleaner
- Wafer Grinder
- Probe Station
- Dicing Saw
- Die Bonder
- Flip Chip Bonder
- Wire Bonder
- Molding Machine
- Test Handler
- Semiconductor Tester
Main Markets
Europe
