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Semiconductor Grade Pink ESD Foam Wafer Interleaf Sheet Shockproof Buffer for Wafer Shipper and Storage
DongGuan Hesion Anti-Static Products Co., Ltd.
Lead Time
| Quantity | 旺季 | 淡季 |
|---|---|---|
| 1 - 5000 | 7 days | 7 days |
| > 5000 | To be negotiated | To be negotiated |
Product profile
- Thickness Range
- 3mm/6mm
- Place of Origin
- Guangdong, China
- Surface Resistivity
- 10^8 ~ 10^11Ω/sq
- Model Number
- HE1006
- Material
- ESD Polyethylene (PE) Foam
- Brand Name
- HESION
- Density
- 20/28 kg (Standard Grade)
- Custom Service
- Thickness, Size, Resistance OEM/ODM
- Static Decay Time
- < 2.0 Seconds
- Application
- Wafer Cushioning, IC Shipping, Electronic Components
- Surface Texture
- Double-Sided Embossed / Wave Pattern (Prevents Adhesion & Scratching)
- Feature
- Shock Absorption, Non-corrosive, Soft
- Color
- Standard ESD Pink
- Selling Units
- Single item
- Type
- Foam
Company profile
DongGuan Hesion Anti-Static Products Co., Ltd.
东莞市恒升防静电用品有限公司Building 1, No. 11, Changheng Road, Changping Town Dongguan Guangdong China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Manufacturer, Trading Company
- Established: 2006
- Plant Area: 4600㎡
- Annual Export Value: Confidential
- Certification: ISO14001,ISO 9001,RoHS,EN 14582,IEC 62321
Main Products
- Plastic Film
- Black Wafer Interleaf
- ESD Grounding Strap
- Conductive Film
- ESD Pad
Main Markets
Domestic Market(20%), Southeast Asia(18%), North America(15%)
