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Silicon Wafer Wire Cutting Machine with PC Wire Cutting Machine Blade
Zhengzhou Cy Scientific Instrument Co., Ltd.
$21000.00 - $23000.00
Lead Time
| Quantity | 旺季 | 淡季 |
|---|---|---|
| 1 - 1 | 15 days | 15 days |
| > 1 | To be negotiated | To be negotiated |
Product profile
- blade size(mm)
- 150
- brand name
- CYKY
- Max. Load Capacity
- 1500KG
- core components
- PLC
- machinery test report
- Provided
- Cutting Speed
- 0.05 - 100 mm/ minute
- warranty
- 1 Year
- Cutting Area
- 1000x1000mm
- dimension(l*w*h)
- 2800x1800x3500mm
- place of origin
- Henan, China
- Wire Moving Speed
- 0 - 5 Meter/ second
- Single package size
- 56X56X56 cm
- Rated Power
- 6000W
- Controller
- touch screen
- no-load speed(rpm)
- 600 rpm
- weight (kg)
- 1000
- power (kw)
- 2
- key selling points
- High-Accuracy
- Keyword
- silicon wafer cutting machine
- Single gross weight
- 54.0 kg
- video outgoing-inspection
- Provided
- Selling Units
- Single item
- voltage
- 220V
Company profile
Zhengzhou Cy Scientific Instrument Co., Ltd.
郑州成越科学仪器有限公司No. 820, 8th Floor, Unit 1, Building 9, No. 6 Cuizhu Street, Zhengzhou High Tech Zone Zhengzhou Henan China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Manufacturer, Trading Company
- Established: 2013
- Employees: 50
- Plant Area: 3474㎡
- Annual Export Value: Above US$100 Million
- Avg. Response Time: ≤ 5h
- Certification: ISO 9001,CE
Main Products
- Electric Furnace
- Magnetron Sputtering Coating Machine
- Plasma Cleaner
- Electrospinning Machine
- Coating Machine
Main Markets
Western Europe(21%), Domestic Market(17%), North America(11%)
