Click to enlarge
Single Side Lapping Polishing Machine for Micron Accuracy of Advanced Ceramic
China GuangdongShenzhen Ponda Grinding Technology Co.,Ltd.
US$14800.00 - 20000.00
MOQ1 Pieces
Product profile
- Power Source
- Electricity
- Disc(Wheel) Type
- Grinding Disc
- Working Style
- Grain
- Variable Speed
- with Variable Speed
- Application
- Grinding Industry
- Material
- Metal and Non-Metal
- Disc Diameter
- φ610 mm / 24 Inches
- Service
- Oversea Setup & After-Sale Avalaible
- Class
- Single Plate
- Process Station
- 3
- Pressure Source
- Pneumatic or Weight Block
- Plate Material
- Metal & Non-Metal
- Abrasive
- Slurry
- Weight
- 1000kg
Company profile
Shenzhen Ponda Grinding Technology Co.,Ltd.
深圳市方达研磨技术有限公司China GuangdongFangda Industrial Park, Guangming, Shenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2007
- Employees: 60
- Plant Area: 11500.0m²
- Avg. Response Time: ≤ 6.84h
- Certification: -
Main Products
- Lapping Machine
- Polishing Machine
- Double-Disc Lapping Machine
- Double-Disc Polishing Machine
- Wafer Thinner
- Substrate Thinner
- Brush-Polishing Machine
- Lathe Machine
- Grinding Machine
- Thinning Machine
Main Markets
Southeast Asia/ Mideast,East Asia(Japan/ South Korea),Domestic,Europe,Australia,North America
