Thermal Pad for Heat Dissipation Protection of High-Power Chips
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Thermal Pad for Heat Dissipation Protection of High-Power Chips

China ShanghaiShanghai Jome Industrial Co., Ltd.

US$0.30 - 0.35

MOQ1 piece

Product profile

Material
Silicone
CAS No.
1314-13-2
Formula
2100
Einecs
Tc5022
Classification
Thermal Pad
Main Agent Composition
Silicone
Characteristic
Heat Conduction
Promoter Composition
Thermal Conductive Powder

Company profile

Shanghai Jome Industrial Co., Ltd.

上海巨密实业有限公司
China ShanghaiShanghai, China
  • CertifiedVerified Supplier
  • CertifiedTrade Assurance
  • Business Type: Manufacturer/Factory
  • Avg. Response Time: ≤ 2.11h
  • Certification: -
  • System Certification: ISO 14001,ISO 9001

Main Products

  • Silicone
  • Epoxy Adhesive
  • Polyurethane Adhesive
  • UV Glue
  • Thread Glue
  • Hot Melt Glue
  • Quick Drying Glue
  • Solvent Glue
  • Uvled Curing Light Source

Main Markets

South America,Eastern Europe,Mid East,North America,Southeast Asia,Eastern Asia,Oceania,Western Europe,Africa