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Tin Lead Solder Bar 63/37 Sn63pb37 for Circuit Boards
China GuangdongFoshan Xi Feng Tin Products Co., Ltd.
US$8.00 - 40.00
MOQ20 kg
Product profile
- Composition
- Tin, Lead
- Percentage of Tin
- From 12 to 63
- Percentage of Lead
- From 35 to 86
- Diemension
- 3.15cm*1.5cm*1.0cm
- Weight
- 500g/PC
- Application
- Lighting, LED, PCB, Precise Instruments, Electroni
- Application 2
- Circuit Boards Assembly
- Application 3
- Circuit Boards Soldering
- Application 4
- Electronics Connection
- Application 5
- Electrical Wire Tinning
- Application 6
- Copper Wire Tinning
- Application 7
- Copper Sheet Joinery
- Alloy
- Sn63pb37
- Alloy 2
- Tin Lead 63 37
- Packing
- 20kgs/Box
Company profile
Foshan Xi Feng Tin Products Co., Ltd.
佛山市西锋锡制品有限公司China GuangdongShunde, Xingtan, Foshan, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Combined
- Established: 2013
- Employees: 11
- Plant Area: 680.0m²
- Avg. Response Time: ≤ 3.46h
- Certification: -
- System Certification: NIL
Main Products
- Solder Wire
- Solder Bar
- Solder Paste
- Solder
- Lead Free Solder Wire
- Tin Lead Solder Paste
- Lead Free Solder Paste
- Tin Solder Wire
- Tin Lead Solder Wire
- Solder Ingot
Main Markets
South America,Africa,Others(foreignTradeCapacity.exportBusinessCapacityMarketOther),Domestic,Europe,Australia,North America
