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Tsg-F830-Lf Hot Air Reflow Soldering Oven, 8 Upper&Lower Heating Zones SMD PCB Reflow Oven for Electronics Production
China GuangdongShenzhen Tengxiangjia Technology Co., Ltd.
US$12500.00 - 38000.00
MOQ1 Pieces
Product profile
- Brand & Model
- Tsg Ew-F830-Lf
- Heating Zone Configuration
- 4 Upper + 4 Lower Heating Zones
- Total Heating Section Length
- 1400mm
- Heating Working Mode
- Full Circulating Hot Air Heating
- Max PCB Width
- 1
- Conveyor Direction
- 300mm
- Control System
- Left to Right
- Conveyor Height
- 880mm, Tolerance ±20mm
- Startup Power
- 13kw
- Stable Working Power
- Approx 3.5kw
Company profile
Shenzhen Tengxiangjia Technology Co., Ltd.
深圳市腾翔佳科技有限公司China GuangdongShenzhen, Guangdong, China- CertifiedVerified Supplier
- CertifiedTrade Assurance
- Business Type: Trading Company
- Established: 2016
- Employees: 15
- Plant Area: 600.0m²
- Avg. Response Time: ≤ 2.94h
- Certification: -
- System Certification: NIL
Main Products
- SMT Machine
- Pick and Place Machine
- Feeder
Main Markets
Domestic
