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UGAIN Solder Paste for Mobile Phone Repair CPU Soldering BGA Chip Rework Solder Paste
Guangdong, ChinaGuangzhou Liwan District Huiyuan Communication Equipment Firm
Lead Time
| Quantity | 旺季 | 淡季 |
|---|---|---|
| 1 - 20 | 15 days | 15 days |
| > 20 | To be negotiated | To be negotiated |
Product profile
- application
- Mobile phones
- Model Number
- 138/158/183/217
- place of origin
- Mainland China
- Single package size
- 15X10X8 cm
- Recommended Uses For Product
- CPU soldering, mobile phone repair
- material
- Solder paste
- Single gross weight
- 0.1 kg
- Selling Units
- Single item
Company profile
Guangzhou Liwan District Huiyuan Communication Equipment Firm
广州市荔湾区汇圆通讯器材商行Guangdong, ChinaNo. 78, 3rd Floor, No. 55, Xidi 2nd Road GuangZhou Guangdong China- CertifiedTrade Assurance
- Business Type: Manufacturer, Distributor/Wholesaler
- Established: 2008
- Employees: 11 - 50 People
- Plant Area: Below 1,000 square meters
- Annual Export Value: US$2.5 Million - US$5 Million
- Avg. Response Time: ≤ 4h
Main Products
- UFS/EMMC Programmer
- Mobile Phone Repair Tools & Equipments
Main Markets
Africa(20.0%), Eastern Europe(20.0%), South America(20.0%), North America(20.0%), Southeast Asia(12.0%), Domestic Market(8.0%)