Ultra Thin Metal Dicing Blade for CSP Compound Semiconductor BGA LGA LED Ceramic Optical Glass Cutting
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Ultra Thin Metal Dicing Blade for CSP Compound Semiconductor BGA LGA LED Ceramic Optical Glass Cutting

Jiangsu, ChinaNanjing Deceal Industrial Machinery Co., Ltd.

US$70.00 - 80.00

Lead Time
Quantity旺季淡季
1 - 100016 days16 days
> 1000To be negotiatedTo be negotiated

Product profile

brand name
DECEAL
machinery test report
Provided
warranty
6 Months
place of origin
Jiangsu, China
Single package size
10X10X5 cm
weight (kg)
0.1
material
Diamond
Single gross weight
0.1 kg
video outgoing-inspection
Provided
Selling Units
Single item

Company profile

Nanjing Deceal Industrial Machinery Co., Ltd.

南京迪赛工业机械有限公司
Jiangsu, ChinaMingjue Industrial Park, Shiqiu Town Nanjing Jiangsu China
  • CertifiedTrade Assurance
  • Business Type: Trading Company
  • Established: 2017
  • Employees: 5 - 10 People
  • Annual Export Value: US$2.5 Million - US$5 Million
  • Avg. Response Time: ≤ 2h

Main Products

  • Industrial blade
  • Mechanical blade
  • Bread slicer blade
  • Shearing Machine Blade
  • Serrated blade

Main Markets

North America(40.0%), Domestic Market(20.0%), Southeast Asia(20.0%), South Asia(1.0%), South America(1.0%), Oceania(1.0%), Western Europe(1.0%), Southern Europe(1.0%), Central America(1.0%), Northern Europe(1.0%), Africa(1.0%), Eastern Europe(1.0%), Mid East(1.0%)