Used China Advanced Multifunctional Semiconductor Equipment Asm Afc Plus Flip Chip Bonder
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Used China Advanced Multifunctional Semiconductor Equipment Asm Afc Plus Flip Chip Bonder

China GuangdongGuangdong Xinling Industrial Co., Ltd

US$100000.00 - 1200000.00

MOQ1 Sets

Product profile

Delivery
1-7 Days
Quality
100% Tested
Adaptation
Flip Chip Bonder
Inventory
Available

Company profile

Guangdong Xinling Industrial Co., Ltd

广东芯灵实业有限公司
China GuangdongChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
  • CertifiedVerified Supplier
  • CertifiedTrade Assurance
  • Business Type: Combined
  • Established: 2021
  • Employees: 11
  • Plant Area: 600.0m²
  • Avg. Response Time: ≤ 5.43h
  • Certification: -

Main Products

  • One-Stop SMT Equipment and Parts
  • SMT Screen Printer
  • Chip Mounter
  • One-Stop Semiconductor Equipment and Part
  • Die Bonders
  • Wire Bonders
  • Test Handler
  • Wafer Dicing Saw
  • Fiber Optic Cable
  • Optical Transceiver

Main Markets

Others(foreignTradeCapacity.exportBusinessCapacityMarketOther),Domestic,Europe