YCS 2020 Double Layer Solder Wick Desoldering Braid for Mobile Phone PCB BGA Repair Solder Wick Remover Desoldering Wire Line
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YCS 2020 Double Layer Solder Wick Desoldering Braid for Mobile Phone PCB BGA Repair Solder Wick Remover Desoldering Wire Line

Guangdong, ChinaShenzhen Hodaxin International Trade Co., Ltd.

US$7.76 - 10.05

MOQ1 pieces

Lead Time
Quantity旺季淡季
1 - 1007 days7 days
101 - 50010 days10 days
501 - 100010 days10 days
> 1000To be negotiatedTo be negotiated

Product profile

application
Computer & Laptop, Mobile phones
Voltage
NO
place of origin
Guangdong, China
Single package size
XX cm
material
Soldering wick
Warranty
1 Year
Selling Units
Single item

Company profile

Shenzhen Hodaxin International Trade Co., Ltd.

深圳市浩达鑫皮具有限公司Guangdong, China3rd Floor, North Tower Of Jindao Science Park, Fifth Industrial Zone, Shiyan Subdistrict Shenzhen Guangdong China
  • CertifiedTrade Assurance
  • Business Type: Manufacturer, Trading Company
  • Established: 2014
  • Employees: 11 - 50 People
  • Plant Area: Below 1,000 square meters
  • Annual Export Value: US$1 Million - US$2.5 Million
  • Avg. Response Time: ≤ 3h

Main Products

  • Phone Polishing machine
  • Laser Back Glass Remove Machine
  • Phone Screen Polishing Machine
  • Bubble Remove Machine
  • OCA Laminating Machine

Main Markets

North America(50.0%), Western Europe(10.0%), Mid East(10.0%), Eastern Europe(10.0%), Northern Europe(10.0%), Southern Europe(5.0%), South America(5.0%)

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