Click to enlarge
Automatic Wire Ball Bonder / IC to Package Wire Bonding Machine
China GuangdongGuangzhou Minder-Hightech co.,Ltd
$72000.00 - $150000.00
MOQ1 Pieces
Product profile
- Size
- 1230mm*940*1660
- Weight
- 800 Kg
- Rated Power
- 1200 W
- Compressed Air
- ≥0.3~0.5 Bar
Company profile
Guangzhou Minder-Hightech co.,Ltd
广州铭钿高精焊接设备有限公司China GuangdongRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China- CertifiedTrade Assurance
- Business Type: Trading Company
- Established: 2014
- Employees: 10
- Plant Area: 260.0m²
- Avg. Response Time: ≤ 12.12h
- System Certification: NIL
Main Products
- Wire Bonder
- Soldering Machine
- Bond Tester
- Grinder and Polisher
- Dicing Saw
- Die Bonder
- Plasma Surface Treatment Machine
- Ultrasonic Metal Welder
- Glue Dispenser
- Parallel Sealing Welder
Main Markets
Europe,North America
