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High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
China JiangsuJiangsu Himalaya Semiconductor Co., Ltd.
$5000.00 - $70000.00
MOQ1 Pieces
Product profile
- Max Bonding Area
- X: 56mm, Y: 80mm
- Positioning Accuracy
- ±3μm (@3
- Bonding Cycle Time
- 45ms/Wire
- Wire Diameter Range
- Dia 15 to 50 Micron
- Drive System
- Linear Motor (Direct Drive)
- Repeatability
- ±3μm (@3σ)
- Magazine Compatibility
- L: 100 to 275mm, W: 30 to 90mm, H: 180mm
- Dimensions (W×D×H)
- 985mm × 960mm × 1770mm
Company profile
Jiangsu Himalaya Semiconductor Co., Ltd.
江苏喜马拉雅半导体有限公司China JiangsuRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China- CertifiedVerified Supplier
- Business Type: Trading Company
- Established: 2019
- Employees: 11
- Plant Area: 83.0m²
- Avg. Response Time: ≤ 2.78h
- Certification: -
Main Products
- Die Bonder
- Wire Bonding
- Laser Marking(ID IC Wafer)
- Laser Grooving
- Laser Cutting(Glass Ceramics Wafers Packaging
- Laser Internal Modification Machine Si /Sic Wafe
- Laser Internal Modification Machine Lt/Ln Wafer
- Laser Annealing Machine for Si/Sic
- Automatic Dicing Saw Machine(Wafer Packaging))
- Automatic Silicone Dispensing Equipment
Main Markets
Europe
